BC-60 and BC-100 conveyors have 3-mm wide ESD edge belts and handle PCBs up to 18" wide. Features include variable speed control, front ESD work surface with grounding strap (green or royal blue mats available), Inspect and Pass mode selection with hand and foot pedal for PCB release, and PLC. BC 60 is 600 mm long with a single drive; BC 100 comes with single 1M drive or two 500 mm drives.
Siplace X4i reportedly has a placement speed of more than 100,000 cph. Comes standard with a flexible dual-lane conveyor and four 20-nozzle heads. In dual-lane mode, it is said to achieve placement of 110,000 cph for board sizes up to 250 mm x 380 mm. Larger boards up to 436 mm x 380 mm can be processed when running in single conveyor mode. Has a footprint of 8 ft². Is designed to shorten gantry travel distance between feeders and board. A productivity lane enables parallel mode.
This solder delivery and inert atmosphere control system features a
flow monitor that uses nitrogen pressure levels to indicate the level of solder
in the solder pot, and a heated nitrogen path. Is said to provide accurate
solder pot capacity information. Replaces mechanical probes. Has a method to
‘super-heat’ the nitrogen supply. Reportedly enhances flowed solder
performance.
The Ribbon Spreader Tip is designed to apply a flat 1"
or 1.5" bead of adhesive. Snaps on the end of a static mixer. Is said to
be ideal for any application where a wide, flat ribbon of adhesive is
preferable to a bead shape.
The CR6000 forced hot air Pb-free reflow
system is 12.5' long, computer-controlled, and has six individually managed
upper and lower heat zones. Is said to have large-oven capabilities including a
DT of ±2ºC edge-to-edge heating conformity integrated with a 3-channel
profiler, and a motor-adjustable 17.7" pin conveyor over a 22.4"
stainless steel mesh belt. Has an automatic oiler and an enhanced flux
management system. Includes removable panels. The base unit includes a PCB air
cooler. Optional water-to-air cooling is available, as is nitrogen atmosphere.
Includes 5, 8 and 10-zone models.
Multicore DA100 is a dispensing grade die attach solder paste. Is said to offer thermal management, while providing ease of removal during cleaning. Is comprised of high lead solder with a liquidus/solidus range of 278°C to 305°C; has been optimized for higher temperature processes, typically in excess of 350°C. Has been designed so that the flux residues are easily cleaned with various solvents. Reportedly no incompatibility issues with flux residues and mold compounds. Is said to maintain integrity of copper leadframe. Has been developed to provide low voids, averaging less than 5%.