Indium Debuts Low Voiding No-Clean Paste
Published: 29 October 2007
Indium5.1AT no-clean Pb-free solder paste offers low voiding at via-in-pad (reported 5% range over many different profiles with BGAs), printability, wetting and a robust reflow profile window. Formulated to minimize impact of downtime on printed deposit volumes.
Indium Corp., www.indium.com
Press Releases
- Scanfil and Etteplan Improve Product Life Cycle and Manufacturability with Redesign
- ITW EAE Wins SbS Excellence Gold Award for MPM Edison II ACT (Automatic Changeover Technology)
- ViTrox Strengthens Its Mexico Presence with New Demo Room and Strategic Workforce Expansion
- SMTA Penang Elects Two from KYZEN to Leadership Roles