Multicore DA100 is a dispensing grade die attach solder paste. Is said to offer thermal management, while providing ease of removal during cleaning. Is comprised of high lead solder with a liquidus/solidus range of 278°C to 305°C; has been optimized for higher temperature processes, typically in excess of 350°C. Has been designed so that the flux residues are easily cleaned with various solvents. Reportedly no incompatibility issues with flux residues and mold compounds. Is said to maintain integrity of copper leadframe. Has been developed to provide low voids, averaging less than 5%.

Henkel Corporation, www.henkel.com/electronics