The Slice-Filter-Technique is for double-sided PCB solder joints inspection. Complete object information is included. Is based on an image-processing algorithm that separates image data of the printed sides. Uses pattern matching methods for solder joints and components. Is for prototypes and small batch production. Can test and verify the complete batch or complete series of the product type for the upper side and bottom part. Comes on all MatriX X2 and X 2.5 series models; is offered as upgrade package for the previous MX model. Designed for an inspection area of up to 460 x 350 mm and a variable inspection window of 10 x 10 mm to 30 x 30 mm. Reported resolution to below 5 µm; inspection time is 4 images/sec.
 
MatriX Technologies, www.m-xt.com
 

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