NL900 No-Clean Pb-Free Solder Paste is formulated for SAC and SN100C alloys. Is a modified rosin-based solder paste that is said to offer excellent open time, extended abandon time and good soldering activity with pin probable post soldering residues. Has been designed to provide excellent slump resistance, high-speed stencil printing up to 100 mm/sec., and extended between-print abandon time. Features enhanced activity for tough-to-solder boards and components. Is ROL0 to ANSI/J-STD-004 compliant.

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