EZReball solder ball preform is said to simplify the reballing process. Permits reliable replacement of solder balls on a BGA device. Alignment is reportedly simple with the edges being “squared up” with the sides of the package; is said to eliminate the need for custom frames or fixtures. Adhesive holds balls firmly in place until after reflow. After reflow, the stencil is peeled off. Comes in packages of 15. Stencils are custom made, including SnPb and Pb-free alloys.

BEST Inc., www.solder.net