WS170 water-soluble solder paste is intended for Sn62/Sn63 applications. Reportedly produces fully wetted, shiny solder joints, and has the activity necessary to solder to common hard-to-wet alloys such as gold, platinum, palladium, silver, Alloy 42 and bare copper. Print speeds of up to 6"/sec. have been tested with full aperture fill and no slumping noticed. Benefits are said to include non-hygroscopic formulation, broad process window, 24-hr. stencil life and tack time, minimal to no foam when cleaned, easy-to-clean post-process residues, excellent wetting, repeatable paste deposition, and compatibility with all plating types. Provides up to 8 hrs. response-to-pause time without print degradation.
 

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