Ablestik 8000 Wafer Backside Coating is said to permit efficient coating of the back of wafers with die attach materials down to 20 µm in thickness. Also permits bondline thickness control to customer specifications, maximization of chip footprint through the elimination of the fillet and repeatable material uniformity. Available in conductive and non-conductive formulations; engineered to address the requirements of smaller die sizes (less than 3 mm x 3 mm), enabling production of packages such as COLs, SOs, TSOPs and QFNs. Printing process and full coating of the wafer backside reportedly can take place in as little as 10 sec.; coating thicknesses of 20 µm on wafers as thin as 100 µm and up to 300 mm in diameter.

Henkel Corp., www.henkel.com/electronics