DSP862 no-clean Pb-free solder paste is said to have a broad processing window and accommodates a range of applications. Complies with ROL0 IPC and IPC Class III. Available in standard form as well as green for SAC and most other Pb-free alloys. Has brick definition, extended stencil life and “response-to-pause” time. Provides print speed window from 25 to 150 mm/sec. Handles CSP and QFN on a Pb-free board finishes, OSP-Cu, immersion Ag, immersion Sn, ENIG and LF HASL. Reportedly will perform for at least 8 hr. of continuous printing. Is said to yield no or low solder beading and solder bridging. PWB assemblies in both air and nitrogen reflow using straight ramp or soak profiles up to 200°C. Tack life said to be greater than 48 hr.
 
Qualitek International Inc., www.qualitek.com
 
 

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