VacuNest shape memory board support system is said to handle large board products up to 450 x 450 mm, including backplanes, solar and fuel cell panels and multiple substrate printing. Designed to eliminate problems associated with conventional dedicated or programmable pin tooling systems. Each module consists of a pliable, anti-static chamber containing a foam former surrounded by polymer granules. The chamber can be profiled to match the contours of different populated board undersides. Under vacuum, that profile can be locked into place indefinitely without shrinkage. Releasing the vacuum, manufacturers can reset the nest as an elastic material brings the chamber back to its original position.
 
Novatec EAP, www.novatec-eap.com
 
 

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