Electrolock-XP RoHS-compliant solder pallet material is molded under high pressure, reportedly providing a lower profile surface chemically inert and heat-resistant. Is said to meet flatness and thickness requirements without surface grinding; sustains more than 12,000 cycles of operation with virtually no surface degradation. Is compatible with Pb-free solder and halide flux systems. Can be used as carrier in wave solder and SMT processing applications, including Pb-free soldering, conformal coating, composite tooling, and ESD-safe tooling.

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