Sarcon XR-Pe is a putty-like thermal interface material. Is said to help improve semiconductor performance by transferring unwanted heat to a nearby heat sink. Is silicone-based and conforms to most CPU and semiconductor shapes with a low compression force requirement. Is maintained for applications that require up to 90% material compression. Reportedly offers thermal conductivity of 11 watt/m-k with a broad operating temperature from -60°C to +200°C. Is available in 2.0 or 1.5-mm thick sheets up to a maximum dimension of 300 mm x 200 mm. Can be ordered in die-cut form.

Fujipoly America Corp., www.fujipoly.com