Sarcon SPG-15A form-in-place thermal interface compound now comes in 30 and 50cc pneumatic syringes, said to permit faster and more accurate dispensing. The single-component gap filler compound offers near-zero compression force with conformability. Is reportedly ideal for filling gaps around PCB solder points. Requires no heat curing; will not cause corrosion on metal surfaces, and maintains all initial properties across a temperature range of -40° to + 150°C.
Fujipoly America Corp.,
www.fujipoly.com
