These hot bar soldering systems are designed to bond unlikely materials to PCBs, such as flex circuits, ribbon cables, wires and edge connectors. Are semi-automatic pulse bonders that employ thermode technology to generate rapid reflow by pulse heating. Reportedly permit materials with low-temperature resistance to be soldered at Pb-free-compatible high temperatures without damage to the devices being permanently attached to circuit boards. System PBS212 offers an in/out shuttle that moves processing linearly; system PBS213 does it with an in/out 180º rotating table. Both perform the bonding process automatically. Soldering profile is programmable, including pressure, temperature, heat-up and cool-down times. Processing duration ranges 12 to 15 sec.