Indium8.9HF solder paste is halogen- and Pb-free. Said to offer print transfer efficiency and response-to-pause printing. Suited for 0.4 mm pitch and 0201 technologies. Reportedly possesses a unique activator package and outstanding oxidation barrier, which permits it to coalesce and wet on par with halogen-containing pastes. Oxidation barrier also ensures there is no graping on small passives. Can be manufactured with SnPb powder for use on products currently exempt from RoHS.
Indium Corp., www.indium.com