SN100C P520 D5 Pb-free solder paste is said to reduce shrinkage defects, slow intermetallic growth, and offer high-impact strength for 0402 components. Reportedly reflows with minute solder volumes, wets on all common substrates, exhibits minimal cracking of flux residue, and has good hot slump performance.
 
Nihon Superior Co. Ltd., www.nihonsuperior.co.jp
 

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