Cookson Announces Alpha WS-820 Solder Paste
Published: 26 March 2009
WS-820 is halide-free, Pb-free and water-soluble. Reportedly can print 0.012" features at both low and high relative humidity (20% to 65%), and its reflow process window handles straight ramp, short soak or long soak profiles in air. Meets IPC-7095 Class III resistance to voiding. Cleans with warm deionized water. Comes as SAC 305 and SAC 405 alloys and in Type 3 and 4 powder.
Cookson Electronics, www.alpha.cooksonelectronics.com
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