MAP v. 2.17a thermal profiling software permits programming the number of degrees within the peak temperature on any channel, and measuring the time during which the channel was above that temperature. Defines the amount of time (within 5°C) of peak a particular component can withstand without damage. Permits optional alignment of profile channel data using board placement physical dimensions and conveyor speed, reducing the lag time in retrieving information from the back of the board. Is said to predict (within 1 to 2 °C) the board temperatures by adjusting the bottom zone temperature in addition to the traditional top zone adjustment.

 ECD, www.ecd.com

 

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