WS177 lead-free water-soluble solder paste is said to meet standards for solder spread and wetting and meet IPC-7095 Class III resistance to voiding under straight ramp or soak reflow profiles. Is reportedly fully cleanable after two paste reflow cycles, with a wide cleaning process window. Is compatible with SN100C and SN97C alloys with Type 3,4 and 5 solder meshes. Can be used with OSP, ENIG, immersion silver, and immersion tin finishes.

FCT Assembly, www.fctassembly.com

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