Hysol UF3800 is said to provide room temperature fast flow, low temperature cure and reworkability. Is for use with CSPs and BGAs; is suited for handheld communication and entertainment applications. Is halogen-free, with less than 900 ppm chlorine and bromine. Is compatible with a variety of Pb-free and halogen-free solder pastes. Offers a high glass transition temperature. Reportedly offers stable electrical performance under temperature humidity bias.  

Henkel, www.henkel.com/electronics  

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