Henkel Releases Hysol UF3800 Underfill
Published: 26 May 2009
Hysol UF3800 is said to provide room temperature fast flow, low temperature cure and reworkability. Is for use with CSPs and BGAs; is suited for handheld communication and entertainment applications. Is halogen-free, with less than 900 ppm chlorine and bromine. Is compatible with a variety of Pb-free and halogen-free solder pastes. Offers a high glass transition temperature. Reportedly offers stable electrical performance under temperature humidity bias.
Henkel, www.henkel.com/electronics
Press Releases
- PARMI USA, INC. Appoints Juan Arango as Head of Sales and Business Development to Drive U.S. Market Growth
- Naprotek Welcomes Aerospace and Defense Veteran to Board of Directors
- Variosystems Highlights Focus on Full-System Solutions with New Brand Identity
- CE3S Appointed as East Coast Distributor for The Millice Group of Companies