Siplace CA die bonder and SMD placement machine is based on the Siplace X-series platform and processes dies (flip chip and die attach) directly from a wafer, while it can also place conventional SMT components. Reportedly processes up to 36,000 flip-chip components per hour, and can bonds up 36,000 dies per hour at an accuracy of up to 10 µm at 3 sigma. In SMT mode, it reportedly places up to 90,000 cph with an accuracy of 41 µm at 3 sigma. Processes dies from 0.8 to 18.7 mm2 (expanded die bandwidth upon request). Maximum wafer size is 12".

Siemens Electronics Assembly Systems, www.siplace.com

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