caLogo

Alpha CVP-360 Pb-free, no-clean solder paste is formulated with low-Ag SACX 0807 and 0307 alloys. Reportedly delivers excellent printing characteristics, permitting the use of Type-3 solder powder, even when 300 µm features are being printed using a 125 µm stencil. Permits high-speed printing; reduced stencil-cleaning frequency. Has a wide reflow process window.
 
Cookson Electronics Assembly Materials, www.cooksonelectronics.com

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article
Don't have an account yet? Register Now!

Sign in to your account