Cookson Launches Alpha CVP 520 Solder Paste
Published: 01 July 2009
Alpha CVP-520 solder paste is a Pb-free, no-clean, zero-halogen paste designed for pin-in-through-hole assembly of temperature-sensitive components. Reportedly reflows at peak temperatures of 155° to 190°C. Is said to provide fine feature printing on 0.30 mm circles at speeds up to 100 mm/sec., and in-circuit pin test yield.
Cookson Electronics, www.alpha.cooksonelectronics.com
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