Henkel Launches Multicore DA100 Die Attach Solder Paste
Published: 22 July 2009
Multicore DA100 die attach solder paste is suitable for high-lead and Pb-free applications. Incorporates a no-clean, ROLO flux system. Complies with RoHS legislation. Delivers low void formation. Exhibits less that 5% void instances on average. Is formulated to hold a higher metal loading for dispensable applications. Reportedly dispenses easily with high pause time and dot-to-dot consistency.
Henkel, www.henkel.com/electronics
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