Galaxy Thin Wafer System offers process capability of Cp>2 @ +/-12.5 µm. A wafer pallet secures wafers as thin as 75 µm during transport and processing. Is approximately 400 mm²; is flat to less than 10 µm; can accommodate wafers as large as 300 mm. Can be held securely while being processed DirEKt Ball Placement, DirEKt Coat wafer backside coating, protective coating imaging, thermal interface materials deposition, wafer bumping and encapsulation. DirEKt Coat process for deposition of 25 µm thick die attach adhesives and other coatings now has process capability of Cp>2 @ +/-12.5 µm and a total thickness variation of 7 µm on 150 µm wafers up to 200 mm in diameter. Said to be capable of first-pass yield ball placement of 200 µm spheres at 3000 µm pitch, thermal interface materials deposition and wafer bumping.

DEK, www.dek.com

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