Endicott Interconnect Improved HyperBGA Capabilities
Published: 27 August 2009
HyperBGA now packs more power and density with the addition of signal layers, enabling semiconductor devices to run at digital signal speeds surpassing 12 Gb/s. Is said to offer the longest flip-chip BGA life available and outperforms ceramic BGA packages by delivering up to 10 times the reliability. Is made from PTFE material, reportedly eliminating BGA wear out, die cracking, delamination or flip chip bump fatigue. Is assembled using standard SMT processes and materials. Is capable of flip chip, SMT or CSP component attach on both sides. Is Pb-free assembly compatible.
Endicott Interconnect, www.eitny.com
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