Cookson Debuts Alpha JP-500 Solder Paste
Published: 30 September 2009
Alpha JP-500 is a Pb-free no-clean solder paste developed for use in the Mydata MY-500 jet printer. Is zero-halogen and -halide material, with a wide reflow profile window for good solderability on various board/component finishes. Reportedly has good and flux cosmetics after reflow soldering. Reduces random solder balling levels, and can be used for single- or double-reflow. Meets IPC-7095 Class III voiding performance. Does not require nitrogen.
Cookson Electronics, www.cooksonelectronics.com
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