Multicore DA101 incorporates a no-clean, ROLO flux and is formulated for printing processes. Is said to withstand temperatures of 300°to 330°C for high-Pb reflow profiles and Pb-free temperatures between 240° and 270°C. Wets to copper, NiPdAu and Ag finishes, among others. Exhibits less that 5% void instances on average. Can be cleaned with standard cleaning chemistries.

Henkel, www.henkel.com/electronics

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