Over Top Snuggers substrate clamping technology clamps the board flat before enabling finite snugging and clamp control for precise board location. Pulls board flat to enable a strong vacuum tooling contact; clamps are then pulled away from the board surface to permit close edge printing. Automatically adjusts for variations in board thickness, eliminating setup requirements between production batches and runs. Automatically adjusts for out-of-parallel boards. Uses Instinctiv V9 user interface software. Is compatible with all tooling variants, including HD Grid-Lok.
DEK,
www.dek.com
