Q2170 fine-pitch, fine-wire (17 - 75 µm), automatic Al/Au automatic wedge bonder is for smaller lot sizes, multiple product variations and frequent setup changes. Supports prototyping to medium-volume production. Designed for packaging complex hybrid, CoB/PCB and LED display devices; achieves wedge bonding for fine gold, aluminum wire and ribbon, and is said to enable quick package conversions. Operator interface provides point-and-click bonding; unlimited wires; easy bond process editing; extensive program storage, and a bond parameter library. Options include programmable ultrasonic generator (256 increments) with low impedance transducers, programmable temperature controllers (optional dual-loop), application-specific software, and custom machines with a table up to 200 x 300 mm.

Questar Products International, www.questarproducts.com

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