StencilMate polyimide stencil is for reworking and hand-placing leadless devices such as QFNs, MLFs and LGAs. Controllably bumps leadless devices. Build-to-order stencil pairs are said to prevent bridging of neighboring solder joints while accommodating QFNs into stay-in-place stencils on the PCB. After removal of the leadless device, one of the stencils is peeled from its release liner, then aligned on the part. Solder paste is then squeegeed into the stencil apertures and reflowed. After reflow and stencil removal, the device has very uniform bumps, which then permit the leadless device to be placed similar to a BGA. Other processes have a mating stencil on the PCB, and the part is then fitted into the loaded apertures and reflowed. Comes in 0.10 to 0.20 mm thickness.

BEST Inc., www.solder.net

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