Aquasol water-soluble solder paste can be used with any common soldering alloy. SnPb and Pb-free SAC and SN100C versions are available. Exhibits excellent performance in printing (including fine-pitch capability), placement, reflow and cleaning. There is efficient separation from the squeegee and good aperture release with long stencil life. Is possible to print at speeds high enough to meet or exceed the throughput of any SMD line. Features excellent slump resistance; residues can be removed with de-ionized water. Has extended tack time. Voiding is minimized in air and nitrogen processes. Post-soldering flux residue can be removed using hot de-ionized water with or without cleaning agents.

Cobar Solder Products, www.cobar.com

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