XPii-II pick-and-place machine incorporates technology from the iineo platform. Benefits from low-maintenance linear motors, high-resolution digital cameras and advanced on-head optical component sensing. Features two placement heads and uses turret head, intelligent feeders and powerful software. Comes with choice of turret heads and incorporates optical sensors that can detect components as small as 01005 and as large as 50 x 50 mm from picking to placement on-the-fly. Will accommodate components supplied on tape, strip tape, stick and matrix trays. Uses integrated intelligence. Is configurable, permitting two versions: 8 or 12 nozzles, tape trolleys or feeder trolleys, matrix tray sequencer, and an internal matrix tray. Has no restrictions or limitations on component range.

Europlacer, www.europlacer.com

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