Universal Releases GenesisSC Component Placement
Published: 09 April 2010
GenesisSC blends flip-chip assembly capabilities on a Genesis platform. Reportedly provides a complete solution for any production environment. Is tailored for dies and passives placement, including 300 mm wafers. Placement accuracy is said to be ±10 µm @ Cp>1. On-board linear thin film applicator provides dipping capabilities for paste or flux.
Universal Instruments Corp., www.uic.com
