IPC-A-610E, Acceptability of Electronic Assemblies, provides visual acceptance criteria for post-assembly mechanical and soldering assembly requirements. Now addresses additional technologies, including flexible circuits, board-in-board, package-on-package, depanelization and additional SMT terminations. Photos and drawings showing good and bad connections have been updated. Contains 165 new or updated illustrations (800 total). Sections have been reorganized so data and images are easier to find and use. Changes that have occurred in array packaging since the standard’s last revision are also addressed, as are changes to hot tear and filet lifting.

IPC, www.ipc.org

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