Fujiploy Offers Sarcon 100GR-HL Thermal Interface Material
Published: 01 July 2010
Sarcon 100GR-HL thermal interface material is an advanced gap filler pad manufactured with a hardened top surface. Consistently adheres to the target electrical component or opposing heat sink. Can remove without tearing or damaging the material during assembly and rework. Transfers heat with a thermal conductivity of 2.8 W/m°K and a thermal resistance of .44°Cin2/W at 72.5 PSI. This 1.0 mm thick, flame retardant TIM comes in sheets up to 300 x 200 mm.
Fujipoly America Corp., www.fujipoly.com
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