PCB200-Thermal Cycle test board for 15 mm PoP components helps optimize assembly methods that may produce significant thermal gradients across the assembly in the X, Y and Z axes. Helps include a component’s max. temp., ramp rate and solder paste profile. Board size is 132 x 77 mm, 8 layers, 0.039" thick, no microvias; board material is IS-410 high temp. 180 Tg; standard board finish is OSP Entek CU-106A-HT; 15 daisy-chain pad placements for 15 x 15 604 PSvfBGA component; ImAg finish available, and Gerber and X, Y, theta data included.

Practical Components Inc., www.practicalcomponents.com

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