Fine Pitch Bump Adapters accommodate boards with pitches down to 0.40 mm. Permit use of higher pitch devices on smaller pitch boards. Adapter tops have landing pads that can be designed to accept any device on any pitch, and settle into fine pitch footprints, including TSSOP and QFP. Adapter bottom has raised connection pads up to 0.010" that provide easy mounting to the target board. Are 0.062" thick FR4 or Rogers 370 HR, with 1oz. copper traces on both sides. Non-solder mask-defined pads are finished with ENIG. Apparatus can operate up to 221°F for FR4 and 266°F for Pb-free. Are available in tape and reel for high-speed SMT assembly; can be manufactured for RoHS compliance. Standard line and trace spacing down to 0.003" can be used. Are available in panelized form, as adapters only, or as turnkey solutions with devices mounted.

Aries Electronics Inc., www.arieselec.com

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