The Worldwide IC Packaging Market, 2010 Edition offers an in-depth look at the worldwide integrated circuit packaging market. Provides forecasts of individual IC device markets, for units, revenue and ASP from 2008 through 2014. Forecasts package solutions for each of these markets, broken into I/O ranges. An overall worldwide forecast of IC packages, divided into 12 different package families, plus bare die solutions, is also provided.

Major package families include:

• Dual in-line package (DIP)

• Small outline transistor (SOT)

• Small outline (SO)

• Thin small outline package (TSOP)

• Dual flat pack no lead (DFN)

• Chip carrier (CC)

• Quad flat pack (QFP)

• Quad flat pack no lead (QFN)

• Pin grid array (PGA)

• Ball grid array (BGA)

• Fine-pitched ball grid array (FBGA)

• Wafer-level package (WLP)

Unit forecasts for die mounted using direct chip attach methods are offered. CA methods include chip on board (COB), flip chip on board (FCOB), chip on glass (COG), flip chip on glass (FCOG), and tape automated bonding (TAB)/tape carrier package (TCP).

Packaging revenue is generated by multiplying worldwide units with pricing information supplied by the contractor IC package assemblers.

Supplies contract IC packaging market forecast, with units and revenue analyzed by package family. Forecasts are computed by compiling information obtained from each individual contract assembly company. Pricing information is provided by I/O count and price per I/O, and when multiplied by units, yields revenue. Profiles of individual contract IC package assemblers are also provided, as is commentary on the state of the industry.

New Venture Research, www.newventureresearch.com

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