RMA250 Solder Paste is a rosin-based chemistry designed to provide a high level of repeatability and consistency. Reportedly offers excellent open time, extended abandon time, and excellent soldering activity with all surface finishes. Is formulated for fast printing and meets requirements for ANSI/J-STD -004, -005, as well as all Bellcore test criteria. The pin probable paste features excellent print volume consistency with surface area ratios as low as 0.55 when used with UltraSlic stencil technology. Has a low voiding/high-reliability composition and a wide reflow window. Post-process residues are clear and can be removed with a saponifier.

FCT Assembly, www.fctassembly.com

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