3800 Die Bonder has 3.5 µm accuracy, 3 sigma and 2600 UPH over a 35.5" x 20" work envelope. Has quiet linear motors and is fully automated. Is suited for HB/HP LED assembly; microwave modules; RF power amps; complex hybrids; MEMS; laser diodes, and LED printhead attachment. Options include pulse heat and steady state stages for eutectic die attach applications. Comes with a process camera for live viewing of pick-and-place processes. Eight-position tool turret enables rapid tool changes. Has removable side panels with a front facing user interface.

Palomar Technologies, www.palomartechnologies.com

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