PACTECH PCB310 is for placement and daisy chain continuity testing after assembly. Substrate has 28 mounting sites for 10 x 10 mm flip chips; is companion to PACTECH dummy flip chips. Test die are combined with test boards for testing a variety of specs and processes. There are two rows of seven pads. Depending on die, they have either 184 bumps and a bump pitch of 200 µm or 572 bumps and a pitch of 200 µm/400 µm. Evaluation board is 6.3" x 3.95"; has two layers and is 0.062" thick. Board material is high temp Tg. Standard board finish is OSP Entek CU-A-HT.

Practical Components Inc., www.practicalcomponents.com

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