NC676 is a no-clean halogen-free leaded solder paste. Is compatible with 63/37, 62/36/2 alloys with Type 3, 4 and 5 solder meshes. Features print volume consistency down to 12 mm circles and IPC 7095 Class III resistance to voiding using straight ramp and soak reflow profiles. Leaves a penetrable, colorless residue. Reportedly offers excellent resistance to hot and cold slump. Offers minimal residue, shiny SnPb solder joints and excellent solder spread on all common pad finishes. Features high-volume repeatability with 16 mm pitch QFP pads and excellent response to one-hour pause after two knead strokes at 35-65% RH.

FCT Assembly, www.fctassembly.com

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