Dow Corning Releases 3-6751 Thermally Conductive Adhesive
Published: 09 November 2010
3-6751 thermally conductive adhesive is used for bonding heat sinks to electronic devices and PCBs to substrates. Is a two-part kit that is heat curable with a UL94 V-0 rating. Has low viscosity and low modulus quality. Application methods include manual and automated meter-mix and dispensing.
Dow Corning, www.dowcorning.com
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