Four-ply, peel-n-stick FPDSEM 90 cooling patch reduces chip and circuit temperature by as much as 11% without the need for a heatsink. Thermal material radiates heat from an electronic component to the surrounding environment. Apply patch like a sticker to the surface of any hot spot. Can be custom cut or trimmed to fit virtually any shape. Provides a thermal conductivity of 1.5 W/m°K and a thermal emissivity of 0.97. Is 25 mm thick and can be ordered in sheets, rolls or kiss-cut rolls.

Fujipoly America Corp., www.fujipoly.com

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