Koki Releases SB6N58-A730 Solder Paste
Published: 07 December 2010
SB6N58-A730 low-temperature Pb-free solder paste has a melting point of 201-210°C. Demonstrates high thermal shock durability. Contains 6% Indium. Achieves low structural transformation; provides less transformation within the alloy composition.
Koki, http://ko-ki.co.jp/top.html
Christopher Associates, www.christopherweb.com
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