Ablestik C100 series conductive die attach films come in 30 and 15 µm thicknesses. Can process thinner die and facilitate greater bondline control. Die sizes range from 1 x 1mm up to 6 x 6mm for a variety of package types, including QFNs and QFPs. Reportedly show excellent wetting ability and low bonding temperature; robust adhesion against moisture and MSL Level 2 performance on all leadframe surface finishes.

Henkel, www.henkel.com/electronics

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