Multicore MF210 no-clean, sustained activity flux is compatible with Pb-free and SnPb processes.  Halide-free, resin-free material is effective with a range of solder resists, as well as rosin and OSPs. Has a wide process window and a preheat temperature range of 80° to 130°C; has a one- to three-sec. contact time on the wave. Can be used in single- and dual-wave processes. Reduces solder microballing.

Henkel Electronic Materials, www.henkel.com/electronics

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