ME-555 underfill encapsulant was developed for semiconductor packaging and assembly. Is comparable with underfills such as Henkel 4256; offers excellent flow characteristics, thermal cycling reliability and low coefficient of thermal expansion. Is a high purity, semiconductor-grade epoxy underfill material for the encapsulation of flip chip devices. Reduces warpage; handles over-molding processes. Can be used under CSP/BGAs and small dies with standoff heights as small as 25µm. Provides good adhesion to laminate, ceramic, solder mask and metal surfaces, as well as high Tg and high fracture toughness.

Lord Corp., www.lord.com

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