BR810 rework system is for removal, placement and soldering of SMD packages. Profile settings for independent and programmable top and bottom heating can be divided into eight separate segments; each has variable heating rate, target temperature and dwell time. Five separate thermocouple inputs are integrated with control software; provide real-time temperature feedback for parameter adjustment and process control. Has on-board storage capacity for thousands of temperature profiles and an LCD touch-screen display. Includes automated Z-axis motion with vertical height sensing. Features split-vision optics, with 22x electronic zoom and focus controls, and top and bottom LED lighting. Includes ultra-fine micrometer adjustments in the X-, Y- and Θ- axes. Adjustable PCB holder accepts PCBs up to 470 mm x 350 mm. Has a five-zone ceramic IR underheater with programmable power settings and a universal PCB bottom-side support system. Soldering nozzles handle components from 1mm x 1mm to 60mm x 60mm. Software includes password protected user privileges, temperature curve analysis and screen printing functions via USB port for job/lot traceability. Operates on 220V, single-phase AC-power; has a built-in vacuum generator.

Manncorp, www.manncorp.com

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